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Local PWB and Component Bowing of an Assembly Subjected to a Bending Moment
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An analytical model is developed for determining the bowing of a component mounted on a printed wiring board (PWB) that is subjected to a bending moment. The model assumes a uniform elastic ...
Vibration Induced Fatigue Life Estimation of Corner Leads of Peripheral Leaded Components
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The rapid advancement of integrated circuits and associated electronic technologies have placed increasing demands on electronic packaging and its material structures in terms of the reliability ...
Modeling the Vibration Restraints of Wedge Lock Card Guides
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: One of the most dominate parameters that influence the calculation of a PWB’s natural frequency is the boundary conditions along the edges of the board. A series of experiments was conducted ...
Modeling Solder Joint Fatigue Life for Gullwing Leaded Packages: Part I—Elastic Plastic Stress Model
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: It is a challenge to assess solder joint fatigue life in the modern electronics industry because of complex geometries, complex non-linear viscoplastic material properties, and the frequently ...
Estimating the Vibration Fatigue Life of Quad Leaded Surface Mount Components
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper discusses the assumptions and details of the fatigue life calculations required to predict the fatigue life of quad leaded surface mount components operating in a vibration environment. ...
Effect of SMC Lead Dimensional Variabilities on Lead Compliance and Solder Joint Fatigue Life
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Lead compliance is a critical parameter in optimal design and interconnection reliability of surface mount leaded components. The cyclic force transmitted to the solder joint in surface mount ...
Fatigue Analysis of a Planarpak™ Surface Mount Component
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper discusses the thermo-mechanical fatigue life analysis of an analog Avantek Planarpak™ surface mount device where the entire base of the component is soldered directly to the printed ...